The primary responsibility of this position is to perform analysis of products to determine the root cause of failures. This effort will consist of using a variety of mechanical, chemical, and electrical analysis techniques to support failures of customer returns, yield-related issues, and reliability-related concerns.
responsibilities:
* perform failure analyses on complicated issues requiring creative problem-solving and patience.
* apply advanced knowledge in areas such as physical failure analysis, electrical microscopy, and nanoprobing to solve problems, and seek resources from other teams to find alternatives.
* conduct physical failure analysis by examining individual layers of silicon to reveal evidence of defects.
* perform advanced electrical fault isolation analysis using techniques like xiva, obirch, photo emission microscopy, and lock in thermal microscopy to localize areas of interest and isolate defect locations.
* administer non-destructive testing on devices using imaging tools (e.g., x-ray, c-sam) and/or optical inspections.
* contribute to writing papers and publications documenting failure analysis approaches.
* document results of failure analysis, report identified root causes, and deliver conclusions to requesters.
* determine the type of failure analysis needed to identify reported issues and conduct appropriate analysis with minimal guidance.
* act as the case owner for complicated defects, handling all relevant issues.
* participate in process improvements to gain efficiencies or development initiatives and identify innovative methods for identifying and/or preventing defects.
* coordinate with partners in other teams (e.g., design team, product team) to share device issues and work toward solutions.
qualifications:
* bachelor's degree in electrical engineering, microelectronics, physics, or equivalent.
* 2+ years of chip-level failure analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) experience or related work experience.
* 2+ years working in a physical/chemical laboratory setting.
* proficiency in various physical and electrical analysis techniques such as mechanical polishing, chemical delayering, sem inspection, curve trace, thermal emission, photon emission, and obirch/tiva.
* strong knowledge of semiconductor physics, semiconductor devices, circuitry analysis, and wafer fabrication processes.
* experience in sem-based nano-probing with ebic, ebac, and ebirch on planar, soi, and finfet technologies.
* familiarity with scan logic, memory bist, and rf/analog design strategies.
* familiarity with reliability testing for device and packaging product qualification, including cdm, hbm, tlp, htol, bhast, and burn-in.
* excellent communication, organization, and project management skills.
* ability to work in a laboratory environment and collaborate effectively with multi-functional teams.
* quick learner and able to perform independent work.
* flexible working hours, including weekend or midnight shifts.
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