The primary responsibility of this position is to perform analysis of products to determine the root cause of failures.
this effort will consist of using a variety of mechanical, chemical, and electrical analysis techniques to support failures of customer returns, yield-related issues, and reliability-related concerns.responsibilities:perform failure analyses on complicated issues requiring creative problem-solving and patience.apply advanced knowledge in areas such as physical failure analysis, electrical microscopy, and nanoprobing to solve problems, and seek resources from other teams to find alternatives.conduct physical failure analysis by examining individual layers of silicon to reveal evidence of defects.perform advanced electrical fault isolation analysis using techniques like xiva, obirch, photo emission microscopy, and lock in thermal microscopy to localize areas of interest and isolate defect locations.administer non-destructive testing on devices using imaging tools (e.g., x-ray, c-sam) and/or optical inspections.contribute to writing papers and publications documenting failure analysis approaches.document results of failure analysis, report identified root causes, and deliver conclusions to requesters.determine the type of failure analysis needed to identify reported issues and conduct appropriate analysis with minimal guidance.act as the case owner for complicated defects, handling all relevant issues.participate in process improvements to gain efficiencies or development initiatives and identify innovative methods for identifying and/or preventing defects.coordinate with partners in other teams (e.g., design team, product team) to share device issues and work toward solutions.qualifications:bachelor's degree in electrical engineering, microelectronics, physics, or equivalent.2+ years of chip-level failure analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) experience or related work experience.2+ years working in a physical/chemical laboratory setting.proficiency in various physical and electrical analysis techniques such as mechanical polishing, chemical delayering, sem inspection, curve trace, thermal emission, photon emission, and obirch/tiva.strong knowledge of semiconductor physics, semiconductor devices, circuitry analysis, and wafer fabrication processes.experience in sem-based nano-probing with ebic, ebac, and ebirch on planar, soi, and finfet technologies.familiarity with scan logic, memory bist, and rf/analog design strategies.familiarity with reliability testing for device and packaging product qualification, including cdm, hbm, tlp, htol, bhast, and burn-in.excellent communication, organization, and project management skills.ability to work in a laboratory environment and collaborate effectively with multi-functional teams.quick learner and able to perform independent work.flexible working hours, including weekend or midnight shifts.#j-18808-ljbffr