Join itec and connect your unique talents and passion to your goals for a fulfilling career with growth and reward. We are an independent subsidiary of nexperia, itec combines state-of-the-art equipment and automation expertise with 30 plus years of semiconductor manufacturing experience as an equipment and automation partner. From new developments to an installed base of more than 2500 of the industry’s most advanced tools, itec enables all customers to test and assemble sustainably with the world’s fastest production rates.
field service engineer (die bond equipment) will be working under a global service department, comprised of multinational team members. The team is supporting various platforms in regions of sea, china, europe and us.
key responsibilities:
* responsible for installation, setup and buyoff new machines/modules at customer site.
* support assembly sites in problem solving after machine release.
* assist suppliers in technical trouble shooting during serial production.
* actively support in product development stage by giving constructive advice to the product team based on customers feedback.
* execute prototype building and testing of equipment, modules or improvements of existing equipment.
* validate the products in accordance with the design, customers’ requirements and the reliability during product release stage.
* in charge of beta-test at customer site and responsible for resolving technical problems encountered.
* formulate and execute plans to improve machine’s quality/speed/cost performance.
* responsible for training and acceptance of new equipment at the customers.
* facilitate regular technical meetings with customers.
* channel customer feedback via jira case/crs and follow up for closure.
* 2nd line support for system automation onsite, attend, report, liaison with factory, carried out corrective action.
* additional onsite support task and information collection request from itec factory.
qualifications:
* bachelor's degree in mechanical, electrical, or mechatronics engineering.
* 5+ years of experience in semiconductors / electronic manufacturing industry.
* solid experience on high precision assembly equipment in die bond area.
* analytical mindset, strong problem-solving and organizing skills.
* good interpersonal skills and able to deliver results through determination and teamwork.
* good communication skills with fluency in english.
* mature, customer-service oriented and able to work independently.
* willing to travel frequently, both domestic and international.
* stationed at customer’s site.
mindset/culture:
* start-up mentality.
* values: integrity, drive, caring, and teamwork.
* delivers results.
* innovates and simplifies.
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