*test engineering mgmt 2*
*education*:
- communications and electronics engineer
- electronics engineer
- physics engineer
- materials engineer
*experience*:
- 3 years of research experience on semiconductor device fabrication.
- 3 year of electronics devices failure analysis.
- 2 years of research experience on laser diodes, fiber lasers and optical elements.
- 1 year of teaching experience on technical courses.
*knowledge (any of these)*:
- semiconductor device fabrication
- 2d materials (graphene, mos2, ptte2) based fet and memristor device fabrication
- photomask design (layout editor), mask aligner (suss microtec mjb4 & evg 620)
- e-beam lithography (npgs sem)
- e-beam evaporation (temescal, aja and thermionics evaporator) for metal deposition
- atomic layer deposition (ultratech savannah s200) for gate dielectric deposition
- dry etch (plasma-therm 790 rie & plasma-etch pe 50) for sio2 and 2d materials etching
- wedge gold bonding for packaging
- material and electrical characterization techniques (3 years of experience)
- surface profiling of 2d materials by afm (anasys instruments nanoir2), sem imaging of 2d material (zeiss ultra-55 sem), raman and photoluminescence spectroscopy of 2d material, profilometry.
- dc & pulse current-voltage (i-v) measurement, using keysight b1500a and hp 4156a
- capacitance-voltage (cv) & capacitance-time (c-t) measurement using keysight b1500a.
- beam and laser characterization (2 years of experience)
- mode characterization of a laser by razor blade technique
- light coupling using fiber optics
- laser diode characterization by polarization filter and varying temperature
- second harmonic generation by using nd:yag crystals and coupling to a lens objective
- engineering analytical tools
*skills*:
- analytical approach
- organized
- problem solving approach
- systemic thinking
*responsibilities*:
- lead and support the failure analysis groups in the region in critical analyzes to expedite the disposition of bone pile units.
- support the definition and participate on cases related to customer design issues or quality problems with component’s suppliers to mitigate liability risks for sanmina.